Direkt zum Inhalt Direkt zur Hauptnavigation

The MicroProf®: One profilometer for all applications

The MicroProf® profilometer is a powerful, multi-sensor capable tool for all your 2D and 3D surface analysis needs. These non-contact, optical profilers of the MicroProf® series are very versatile and modular measuring systems, from bench top to fully automated that can be used in R&D and on the production floor to enhance your product quality. The tools are offered in different sizes and with a wide range of point, line and field-of-view sensors to measure even the most challenging applications. No matter what you need to measure, whether profile, roughness, topography, TTV or film thickness, these systems are true all-rounders. The MicroProf® excels at measuring all surfaces, from super-smooth to very rough, matt or reflective with sub-nanometer precision. They are easy to use, very robust, future upgradable, and provide instant results for a time and cost efficient operation.
Klicken, um ein neues Bild zu erhalten
Fields marked with a * are mandatory and need to be filled out.

Request Information!

FRT of America, LLC
Phone +1 408 261 2632


One profilometer for all materials

You no longer have to select a profilometer based on the type of surface you want to measure. The MicroProf® systems are based on the tried and tested multi-sensor technology of FRT and are capable of performing numerous measuring tasks on one system. The FRT multi-sensor concept provides the possibility to combine different technologies and measurement ranges in one system and thereby allows you the maximum of flexibility. Offered sensor types include chromatic white light, white light interferometry and confocal microscopy as well as optical thickness and thin film thickness sensors. The optical profilometry made by FRT offers various advantages compared to stylus profilers such as a fast and flexible 2D or 3D surface metrology over a wide range of measuring fields, a non-contact and thus non-destructive analysis of surface structures and no consumable parts (as for example stylus tips). With this technique also very sensitive surfaces as optical parts or soft materials can be measured as well as metals, semiconductors, ceramics or plastics and much more.

Precise direct measurement of any surface

3D surface roughness

Surface roughness, topography and thickness measurement

The determination of the surface roughness, topography and film thickness plays an important role in monitoring, evaluating and optimizing surfaces in a multitude of industrial branches. Covering a wide range from implants for the human body over leather structures for a car interior to high-technology MEMS fabrication, a defined roughness is often closely linked to the part performance. Therefore it has to be examined carefully. Working in a contactless and non-destructive way, our optical profilometers measure 2D and 3D roughness parameters according to the latest DIN/ISO norms applicable. Due to a variety of optical sensors almost every surface can be examined and the roughness is determined reliably and exactly with the MicroProf® systems.

Besides the surface roughness these optical profilometers also measure the surface topography (profiles or area measurements) for the metrological determination of for example waviness, flatness, or step height. For non-contact and non-destructive characterization of thin, transparent or partially transparent layers and multi-layer systems, the MicroProf® profilometer series offers the ideal solution when equipped with a film thickness sensor (mainly reflectometry in various spectral and thickness ranges): Surface measuring equipment for optical film thickness measurement with the highest resolution and accuracy for layers with thicknesses of only a few nanometers to several millimeters.
Multi sensor profilometer

Double sided surface measurement

With the retrofittable TTV option, the MicroProf® can inspect samples (for example wafers) from both sides – and can be upgraded at any time. With the TTV option, dual opposed sensors quickly measure both sides of the sample simultaneously for thickness and total thickness variation (TTV) as well as shape, topography and roughness of both surfaces. Exchangeable fixturing can be used to measure different parts such as wafers, dies, optics, foils, substrates, metals, etc. The MicroProf® TTV can be equipped with a pattern recognition software and also be fully automated with measuring recipes and part handling.

automated wafer handling

Fully automated surface measurements

The MicroProf® profiler can be fully automated with FRT's powerful Acquire Automation XT software. The software can be tailored to your specific needs in order to fulfill even the highest requirements. Single components as well as multiple parts of the same type can be easily measured and analysed with the step-and-repeat functionality. Operators do not need any prior programming skills to create the easy to learn recipes.
With the retrofittable MHU option, the fully automated measurement of samples including part handling can easily be performed. Designed for wafers and general substrates, the MicroProf® accommodates up to 4 cassettes for parts up to 8 inches in diameter and can be fully integrated into the production workflow. A two-arm vacuum gripper automatically places the parts at the defined measuring position. The end effector can easily be changed and adapted to different sample specifications. Optionally, the MicroProf® can also be equipped with sample sorting for good, rework and reject parts.

non contact profilometer

Measurements under thermal load

The MicroProf® profilometer can be equipped with the thermo unit in order to perform measurements of the surface topography of components under controlled thermal load. The samples to be measured are placed on a heating and cooling plate within a closed chamber (glass cover) and heated. The sample temperature can be precisely adjusted and varied using individually configurable temperature profiles. Fully automatic measurements of the surface topography at different temperatures with individually adjustable dwell times at constant temperatures can be performed.